유저 발표
이진형 연구원
Realization of van der Waals SPM device
Jinhyoung Lee1 and Taesung Kim1,*.
1School of Mechanical Engineering, Sungkyunkwan University (SKKU)
Suwon-si, Gyeonggi-do 16419, South Korea
Email address: Tkim@skku.edu.
The invention of scanning probe microscopy revolutionized the way electronic phenomena are visualized and investigated [1]. Whereas present-day probes can access a variety of electronic properties at a single location in space, a scanning microscope that can directly probe the various physical properties of an electron at multiple locations would provide direct access to key electronic properties of van der Waals (vdW) systems, which have been so far unreachable. Here, we demonstrate a conceptually new type of scanning probe microscope device platform, the vdW SPM device, capable of applying local biasing at its SPM tip. The vdW SPM device is based on a metal tip, allowing the creation of various junction types (metal-semiconductor-metal), which provide a multitude of interfacial migration paths for carriers. With the addition of a continuously scanned gate bias between the tip and sample, this microscope probes electronic behavior with local domain configuration and its corresponding lattice structure. Through a series of experiments, we demonstrate various vdW SPM device applications within a metallic SPM tip, directly deriving the correlation between stacking order and interfacial carrier dynamics. In conclusion, we envision that our vdW SPM device can pave the way for versatile advances in vdW materials and their corresponding next-generation device applications.
[1] a)G. Kim, J. Lee, H. Seok, T. Kang, M. Lee, H. Choi, S. Son, J. Cho, D. Lee, S. Son, Advanced Materials 2025, 37, 2419927; b)J. Lee, E. Kim, J. Cho, H. Seok, G. Woo, D. Yu, G. Jung, H. Hwangbo, J. Na, I. Im, Advanced Science 2024, 11, 2305512; c)J. Lee, G. Kim, H. Seok, H. Choi, H. Lee, S. Lee, G. Kim, H. Kim, S. Son, S. Son, Advanced Science 2025, e04746; d)J. Lee, G. Woo, J. Cho, S. Son, H. Shin, H. Seok, M.-J. Kim, E. Kim, Z. Wang, B. Kang, Nature communications 2024, 15, 5162.